U.S., Oct. 29 -- An application to own the trademark for 'CUKINDHAY' has been filed on Apr. 01, 2025. Owner(s): Changsha Liukangda Trading Co., Ltd.; Room 153, 1/F, Chunhua Agricultural Trade Servic... Read More
U.S., Oct. 29 -- An application to own the trademark for 'NCNXNN' has been filed on Apr. 01, 2025. Owner(s): Shenzhen Chisuheng Technology Co., Ltd; 120, Building T24, South China International Text... Read More
U.S., Oct. 29 -- An application to own the trademark for 'KONWLANG' has been filed on Apr. 01, 2025. Owner(s): Ganzhou Luoyou E-Commerce Co., Ltd.; Li Yahuang's self-built house, No. 60, Building 9,... Read More
Japan, Oct. 29 -- MOFFETT INTERNATIONAL CO LTD has got intellectual property rights for 'METHOD AND SYSTEM FOR HIERARCHICALLY WEIGHTED SPARSE CONVOLUTION PROCESS.' Other related details are as follows... Read More
Japan, Oct. 29 -- FUKUI PREFECTURE has got intellectual property rights for 'MANUFACTURING METHOD AND MANUFACTURING DEVICE FOR THERMOPLASTIC RESIN PREPREG SHEET.' Other related details are as follows:... Read More
Japan, Oct. 29 -- HONDA MOTOR CO LTD has got intellectual property rights for 'GAS CHARGING METHOD.' Other related details are as follows: Application Number: JP,2022-154474 Category (FI): F17C5/06,... Read More
Japan, Oct. 29 -- HHELI LLC has got intellectual property rights for 'BATTERY CELL WITH NOVEL CONSTRUCTION.' Other related details are as follows: Application Number: JP,2024-010245 Category (FI): H... Read More
Japan, Oct. 29 -- GEORGIA TECH RESEARCH CORP has got intellectual property rights for 'MICRONEEDLE PATCHES, SYSTEMS AND METHODS.' Other related details are as follows: Application Number: JP,2023-213... Read More
Japan, Oct. 29 -- SHIN ETSU CHEM CO LTD has got intellectual property rights for 'ONIUM SALT, ACID DIFFUSION CONTROLLER, RESIST COMPOSITION, AND PATTERNING METHOD.' Other related details are as follow... Read More
Japan, Oct. 29 -- SHIN ETSU CHEM CO LTD has got intellectual property rights for 'WAFER EDGE PROTECTION FILM FORMING METHOD, PATTERNING PROCESS, AND COMPOSITION FOR FORMING WAFER EDGE PROTECTION FILM.... Read More