ALEXANDRIA, Va., Nov. 18 -- United States Patent no. D1,102,110, issued on Nov. 18, was assigned to Yiwu Pumei Brand Management Co. Ltd. (Yiwu, China). "Clog" was invented by Jing Xing (Jinhua, China... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,472,521, issued on Nov. 18, was assigned to APTAR RADOLFZELL GMBH (Radolfzell, Germany). "Liquid dispenser with two liquid reservoirs" was inve... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,776, issued on Nov. 18. "Systems and methods for the implementation of interchangeable door panels" was invented by Armin Ghauforian (Coqui... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,475,735, issued on Nov. 18, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Display panel and display apparatus" was invented by Yuzh... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,929, issued on Nov. 18, was assigned to SHENZHEN ZOLON TECHNOLOGY Co. LTD. (Shenzhen, China). "Data read-write control method and electroni... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,474,219, issued on Nov. 18, was assigned to RADIANT INNOVATION INC. (Hsinchu County, Taiwan). "Dual-purpose temperature measuring device" was i... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. D1,102,181, issued on Nov. 18, was assigned to Zhuhai Pristar Technology Co. Ltd. (Zhuhai, China). "Tool organizer" was invented by Jinpei Li (Gua... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,026, issued on Nov. 18, was assigned to HAMM AG (Tirschenreuth, Germany). "Method for operating a soil processing machine" was invented by ... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,473,073, issued on Nov. 18, was assigned to THE BOEING COMPANY (Arlington, Va.). "Wingtip attachment with a reduction in in-tank work and aerod... Read More
ALEXANDRIA, Va., Nov. 18 -- United States Patent no. 12,476,160, issued on Nov. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package and method of fabricat... Read More