ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,909, issued on Nov. 25, was assigned to DISH WIRELESS LLC (Englewood, Colo.). "Repair atomic deterministic next action" was invented by Sha... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,053, issued on Nov. 25, was assigned to DISCO Corp. (Tokyo). "Holding table assembly and processing method" was invented by Kentaro Iizuka ... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,795, issued on Nov. 25, was assigned to Ricoh Co. Ltd. (Tokyo). "Communication terminal, display method, and non-transitory computer-readab... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,188, issued on Nov. 25, was assigned to TOHOKU UNIVERSITY (Sendai, Japan). "Method for manufacturing composite member, and composite member... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,177, issued on Nov. 25, was assigned to Compagnie Generale Des Etablissements Michelin (Clermont-Ferrand, France). "Facility and method for... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,479,707, issued on Nov. 25, was assigned to KING TREE HANDICRAFTS (SHENZHEN) Co. LTD. (Shenzhen, China). "Christmas tree built-in lifting devic... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,342, issued on Nov. 25, was assigned to NoiseAware Inc. (Dallas). "System and method for generating an alert based on noise" was invented b... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,483,712, issued on Nov. 25, was assigned to Intel Corp. (Santa Clara, Calif.). "Enhanced real-time visual quality metric generation for video c... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,642, issued on Nov. 25, was assigned to Elemental Scientific Inc. (Omaha, Neb.). "Nanoparticle baseline and particle detection threshold de... Read More
ALEXANDRIA, Va., Nov. 25 -- United States Patent no. 12,482,779, issued on Nov. 25, was assigned to Intel Corp. (Santa Clara, Calif.). "Hybrid backside thermal structures for enhanced ic packages" wa... Read More