ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,437,155, issued on Oct. 7, was assigned to American International Group Inc. (New York). "Information extraction system for unstructured documen... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,316, issued on Oct. 7, was assigned to Zumtobel Lighting GmbH (Dornbirn, Austria). "Use of lines in a lighting strip system for data communi... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,157, issued on Oct. 7, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Camera device and optical instrument" was invented by Sang... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,615, issued on Oct. 7, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Systems and methods for transferring data communication in... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,552, issued on Oct. 7, was assigned to NXP USA Inc. (Austin, Texas). "Voltage regulator which redundantly monitors for an over-voltage condi... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,200, issued on Oct. 7, was assigned to Harman International Industries Inc. (Stamford, Conn.). "Loudspeaker assembly with a waveguide" was i... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,439,262, issued on Oct. 7, was assigned to Intel Corp. (Santa Clara, Calif.). "Adaptation of spatial reuse for extremely high throughput" was in... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,434,711, issued on Oct. 7. "Method and related system for estimating the International Roughness Index of a road segment" was invented by Lorenz... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,436,951, issued on Oct. 7, was assigned to SAP SE (Walldorf, Germany). "Dynamic operator pruning based on state dependencies and intermediate re... Read More
ALEXANDRIA, Va., Oct. 8 -- United States Patent no. 12,438,134, issued on Oct. 7, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Package substrate and semiconductor package in... Read More