INTERNATIONAL PATENT: NEC CORPORATION, 日本電気株式会社 FILES APPLICATION FOR "INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND PROGRAM"

GENEVA, July 29 -- NEC CORPORATION (7-1, Shiba 5-chome, Minato-ku, Tokyo1088001), 日本電気株式会社 (東京都港区芝&#20... Read More

INTERNATIONAL PATENT: FUJI CORPORATION, 株式会社ＦＵＪＩ FILES APPLICATION FOR "COMPONENT SUPPLY SYSTEM, STORAGE DEVICE AND COMPONENT SUPPLY DEVICE"

GENEVA, July 29 -- FUJI CORPORATION (19 Chausuyama, Yamamachi, Chiryu-shi, Aichi4728686), 株式会社ＦＵＪＩ (愛知県知立&#24... Read More

INTERNATIONAL PATENT: FAST ACCOUNTING, CO., LTD., ファーストアカウンティング株式会社 FILES APPLICATION FOR "INFORMATION PROCESSING DEVICE, INFORMATION PROCESSING METHOD AND PROGRAM"

GENEVA, July 29 -- FAST ACCOUNTING, CO., LTD. (3rd floor, VORT Hamamatsu-cho I, 1-6-15, Hamamatsu-cho, Minato-ku, Tokyo1050013), ファーストアカウ&#12531... Read More

INTERNATIONAL PATENT: NTT, INC., ＮＴＴ株式会社 FILES APPLICATION FOR "ACOUSTIC SYNTHESIS SYSTEM"

GENEVA, July 29 -- NTT, INC. (5-1, Otemachi 1-chome, Chiyoda-ku, Tokyo1008116), ＮＴＴ株式会社 (東京都千代田区&#2282... Read More

INTERNATIONAL PATENT: MITSUBISHI ELECTRIC CORPORATION, 三菱電機株式会社 FILES APPLICATION FOR "HEAT PUMP SYSTEM"

GENEVA, July 29 -- MITSUBISHI ELECTRIC CORPORATION (7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008310), 三菱電機株式会社 (東京都&#2131... Read More

INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "POSITIVE PHOTOSENSITIVE RESIN COMPOSITION, INSULATING RESIN FILM, METHOD OF FORMING INSULATING RESIN FILM AND SEMICONDUCTOR DEVICE"

GENEVA, July 29 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都&#28... Read More

INTERNATIONAL PATENT: MITSUBISHI ELECTRIC CORPORATION, 三菱電機株式会社 FILES APPLICATION FOR "METHOD, PROGRAM, DEVICE AND SYSTEM FOR ESTIMATING PARAMETER OF TARGET SYSTEM"

GENEVA, July 29 -- MITSUBISHI ELECTRIC CORPORATION (7-3, Marunouchi 2-chome, Chiyoda-ku, Tokyo1008310), 三菱電機株式会社 (東京都&#2131... Read More

INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE, SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING SUBSTRATE MATERIAL FOR SEMICONDUCTOR PACKAGE"

GENEVA, July 29 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都&#28... Read More

INTERNATIONAL PATENT: NTT, INC., ＮＴＴ株式会社, NTT DOCOMO, INC., 株式会社ＮＴＴドコモ FILES APPLICATION FOR "WIRELESS RELAY SYSTEM AND WIRELESS RELAY METHOD"

GENEVA, July 29 -- NTT, INC. (5-1, Otemachi 1-chome, Chiyoda-ku, Tokyo1008116), ＮＴＴ株式会社 (東京都千代田区&#2282... Read More

INTERNATIONAL PATENT: NTT DOCOMO, INC., 株式会社ＮＴＴドコモ FILES APPLICATION FOR "INFORMATION PROCESSING DEVICE AND INFORMATION PROCESSING METHOD"

GENEVA, July 29 -- NTT DOCOMO, INC. (11-1, Nagatacho 2-chome, Chiyoda-ku, Tokyo1006150), 株式会社ＮＴＴドコモ (東京都&#213... Read More

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