ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,107, issued on July 29, was assigned to Ambarella International LP (Santa Clara, Calif.). "Object-aware temperature anomalies monitoring an... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. D1,085,671, issued on July 29. "Textured insole" was invented by Thomas C. Michaud (Wayland, Mass.). The patent was filed on April 3, 2023, under... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,372,309, issued on July 29, was assigned to Furukawa Electric Co. Ltd. (Tokyo). "Heat sink" was invented by Yosuke Watanabe (Tokyo). According... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,375,737, issued on July 29, was assigned to Charter Communications Operating LLC (St. Louis). "System and methods for providing a converged adv... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,370,671, issued on July 29, was assigned to XI'AN JIAOTONG UNIVERSITY (Xi'an, China). "Bearing-type twin-pivot continuum robot" was invented by... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,374,227, issued on July 29. "Smartphone marine vessel location and collision avoidance system" was invented by Robert Ryan (Mattapoisett, Mass.... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,371,781, issued on July 29, was assigned to Lam Research Corp. (Fremont, Calif.). "In situ protective coating of chamber components for semicon... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,370,394, issued on July 29, was assigned to Oshkosh Corp. (Oshkosh, Wis.). "Repositionable console" was invented by Eric R. Linsmeier (Larsen, ... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. D1,085,872, issued on July 29, was assigned to Pratt Corrugated Holdings Inc. (Brookhaven, Ga.). "Box with locking tab" was invented by Kendrick M... Read More
ALEXANDRIA, Va., July 30 -- United States Patent no. 12,375,842, issued on July 29, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan). "Semiconductor device package and acou... Read More