US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING, TSMC NANJING on Sept. 22 for "Semiconductor device and manufacturing method thereof" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,414, issued on Sept. 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan) and TSMC NANJING COMPANY Ltd. (N... Read More

US Patent Issued to HUNAN SAN'AN SEMICONDUCTOR on Sept. 22 for "HEMT device and semiconductor device" (Chinese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,415, issued on Sept. 22, was assigned to HUNAN SAN'AN SEMICONDUCTOR Co. LTD. (Changsha, China). "HEMT device and semiconductor device" was... Read More

US Patent Issued to Intel on Sept. 22 for "Gate-all-around integrated circuit structures having fin stack isolation" (Oregon Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,416, issued on Sept. 22, was assigned to Intel Corp. (Santa Clara, Calif.). "Gate-all-around integrated circuit structures having fin stac... Read More

US Patent Issued to Renesas Electronics on Sept. 22 for "Semiconductor device and method of manufacturing the same" (Japanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,417, issued on Sept. 22, was assigned to Renesas Electronics Corp. (Tokyo). "Semiconductor device and method of manufacturing the same" wa... Read More

US Patent Issued to FUJI ELECTRIC on Sept. 22 for "Semiconductor device and method of manufacturing semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,418, issued on Sept. 22, was assigned to FUJI ELECTRIC Co. LTD. (Kawasaki, Japan). "Semiconductor device and method of manufacturing semic... Read More

US Patent Issued to Wolfspeed on Sept. 22 for "Gate trench power semiconductor devices having shaped deep support shields that reduce cell pitch and on-state resistance" (North Carolina Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,419, issued on Sept. 22, was assigned to Wolfspeed Inc. (Durham, N.C.). "Gate trench power semiconductor devices having shaped deep suppor... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Sept. 22 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,421, issued on Sept. 22, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Dong... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 22 for "Semiconductor device and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,422, issued on Sept. 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor device and manu... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 22 for "Semiconductor structure" (Taiwanese Inventor)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,423, issued on Sept. 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure" was ... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Sept. 22 for "Semiconductor structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 24 -- United States Patent no. 12,745,424, issued on Sept. 22, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and m... Read More

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