US Patent Issued to Onanon on July 14 for "Resistive heating wire termination system" (California Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,876, issued on July 14, was assigned to Onanon Inc. (Milpitas, Calif.). "Resistive heating wire termination system" was invented by Dennis ... Read More

US Patent Issued to PRATT & WHITNEY CANADA on July 14 for "Electron beam brazing to repair component" (Texas Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,877, issued on July 14, was assigned to PRATT & WHITNEY CANADA CORP. (Longueuil, Canada). "Electron beam brazing to repair component" was i... Read More

US Patent Issued to Illinois Tool Works on July 14 for "System and method for determining whether to clean a reflow oven" (Chinese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,878, issued on July 14, was assigned to Illinois Tool Works Inc. (Glenview, Ill.). "System and method for determining whether to clean a re... Read More

US Patent Issued to L'Air Liquide Societe Anonyme Pour l'Etude et l'Exploitation des Procedes Georges Claude on July 14 for "Surface treatment method" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,879, issued on July 14, was assigned to L'Air Liquide Societe Anonyme Pour l'Etude et l'Exploitation des Procedes Georges Claude (Paris). "... Read More

US Patent Issued to KOH YOUNG TECHNOLOGY on July 14 for "Device and method for optimizing control parameter of solder printing apparatus" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,880, issued on July 14, was assigned to KOH YOUNG TECHNOLOGY INC. (Seoul, South Korea). "Device and method for optimizing control parameter... Read More

US Patent Issued to Pac Tech-Packaging Technologies on July 14 for "Laser-assisted soldering apparatus and solder deposition machine" (German Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,881, issued on July 14, was assigned to Pac Tech-Packaging Technologies GmbH (Nauen, Germany). "Laser-assisted soldering apparatus and sold... Read More

US Patent Issued to SAMSUNG ELECTRONICS on July 14 for "Substrate processing apparatus" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,882, issued on July 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Substrate processing apparatus" was inven... Read More

US Patent Issued to Valmont Industries on July 14 for "System, method and apparatus for stud welding" (Nebraska Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,883, issued on July 14, was assigned to Valmont Industries Inc. (Omaha, Neb.). "System, method and apparatus for stud welding" was invented... Read More

US Patent Issued on July 14 for "Male adaptor for tungsten inert gas welding" (Nevada Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,884, issued on July 14. "Male adaptor for tungsten inert gas welding" was invented by Jacob McClure (Las Vegas). According to the abstract... Read More

US Patent Issued to Honda Motor on July 14 for "Bonding device and bonding method for friction stir bonding and resistance welding" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,678,885, issued on July 14, was assigned to Honda Motor Co. Ltd. (Tokyo). "Bonding device and bonding method for friction stir bonding and resi... Read More

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