US Patent Issued on Aug. 18 for "Apparatus and method for selectively forming a shielding layer on a semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,931, issued on Aug. 18. "Apparatus and method for selectively forming a shielding layer on a semiconductor package" was invented by GunHyuc... Read More

US Patent Issued to JCET STATS ChipPAC Korea on Aug. 18 for "Semiconductor device and method of forming EMI shielding material in two-step process using light sintering" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,932, issued on Aug. 18, was assigned to JCET STATS ChipPAC Korea Ltd. (South Korea). "Semiconductor device and method of forming EMI shield... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 18 for "Energy harvest and storage device for semiconductor chips and methods for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,933, issued on Aug. 18, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Energy harvest and storage device f... Read More

US Patent Issued to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "First chip and wafer bonding method and chip stacking structure" (Chinese Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,934, issued on Aug. 18, was assigned to WUHAN XINXIN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hubei, China). "First chip and wafer bonding met... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 18 for "Semiconductor devices comprising first to third overlay structures penetrating through first to third mold structures on overlay mark region and data storage systems including the same" (South Korean Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,935, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor devices comprising first to... Read More

US Patent Issued to Astera Labs on Aug. 18 for "Cross-mesh power distribution layout with low loop inductance and method of manufacture" (California, Texas Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,936, issued on Aug. 18, was assigned to Astera Labs Inc. (Santa Clara, Calif.). "Cross-mesh power distribution layout with low loop inducta... Read More

US Patent Issued to AT&S (Chongqing) on Aug. 18 for "Component carrier and method of manufacturing the same" (Chinese Inventor)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,937, issued on Aug. 18, was assigned to AT&S (Chongqing) Co. Ltd. (Chongqing, China). "Component carrier and method of manufacturing the sa... Read More

US Patent Issued to TEXAS INSTRUMENTS on Aug. 18 for "Sintered metal flip chip joints" (Texas Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,938, issued on Aug. 18, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Sintered metal flip chip joints" was invented by Kurt Peter Wacht... Read More

US Patent Issued to Infineon Technologies on Aug. 18 for "Pre-molded lead frames for semiconductor packages" (Singaporean Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,939, issued on Aug. 18, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Pre-molded lead frames for semiconductor packages" ... Read More

US Patent Issued to Nexperia on Aug. 18 for "Power semiconductor device attached to a lead frame" (Dutch Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,940, issued on Aug. 18, was assigned to Nexperia B.V. (Nijmegen, Netherlands). "Power semiconductor device attached to a lead frame" was in... Read More

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