US Patent Issued to Samsung Display on May 19 for "Display device" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,576, issued on May 19, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device" was invented by Sang Jo Kim (Daej... Read More

US Patent Issued to SUNRISE MEMORY on May 19 for "Memory device including arrangement of independently and concurrently operable tiles of memory transistors" (Japanese, American Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,577, issued on May 19, was assigned to SUNRISE MEMORY Corp. (San Jose, Calif.). "Memory device including arrangement of independently and co... Read More

US Patent Issued to CHUZHOU HKC OPTOELECTRONICS TECHNOLOGY, HKC on May 19 for "Display panel and display screen with a light-emitting assembly and a light-filtering assembly" (Chinese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,578, issued on May 19, was assigned to CHUZHOU HKC OPTOELECTRONICS TECHNOLOGY Co. LTD. (Chuzhou City, China) and HKC CORPORATION LIMITED (She... Read More

US Patent Issued to Yangtze Memory Technologies on May 19 for "Chip package structures, manufacturing methods thereof and electronic devices" (Chinese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,579, issued on May 19, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Chip package structures, manufacturing methods ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on May 19 for "Semiconductor packages" (South Korean Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,580, issued on May 19, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor packages" was invented by Change... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on May 19 for "Package structure and method for forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,581, issued on May 19, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (hSINCHU, Taiwan). "Package structure and method for form... Read More

US Patent Issued to SEIKO NPC on May 19 for "Optical device and method of manufacturing optical device" (Japanese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,582, issued on May 19, was assigned to SEIKO NPC Corp. (Tokyo). "Optical device and method of manufacturing optical device" was invented by ... Read More

US Patent Issued to Tokyo Electron on May 19 for "Sequential complimentary FET incorporating backside power distribution network through wafer bonding prior to formation of active devices" (New York Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,583, issued on May 19, was assigned to Tokyo Electron Ltd. (Tokyo). "Sequential complimentary FET incorporating backside power distribution ... Read More

US Patent Issued to GlobalFoundries U.S. on May 19 for "Three-dimensional integrated circuit with top chip including schottky diode body contact" (Singaporean, Indian Inventors)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,584, issued on May 19, was assigned to GlobalFoundries U.S. Inc. (Malta, N.Y.). "Three-dimensional integrated circuit with top chip includin... Read More

US Patent Issued to SHANGHAI TIANMA MICROELECTRONICS on May 19 for "Display panel and display apparatus" (Chinese Inventor)

ALEXANDRIA, Va., May 19 -- United States Patent no. 12,635,585, issued on May 19, was assigned to SHANGHAI TIANMA MICROELECTRONICS Co. LTD. (Shanghai). "Display panel and display apparatus" was inven... Read More

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