US Patent Issued to Zhuhai ACCESS Semiconductor on Feb. 10 for "Carrier plate for preparing package substrate, package substrate structure and manufacturing method thereof" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,774, issued on Feb. 10, was assigned to Zhuhai ACCESS Semiconductor Co. Ltd (Guangdong, China).

"Carrier plate for preparing package substrate, package substrate structure and manufacturing method thereof" was invented by Xianming Chen (Guangdong, China), Jindong Feng (Guangdong, China), Benxia Huang (Guangdong, China), Gao Huang (Guangdong, China) and Juchen Huang (Guangdong, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A carrier plate for preparing a package substrate according to an embodiment includes a dielectric layer, a seed layer in the dielectric layer, and a copper pillar layer on the seed layer. A bottom end of the seed layer is h...