ALEXANDRIA, Va., June 9 -- United States Patent no. 12,289,872, issued on April 29, was assigned to VOLKSWAGEN AG (Wolfsburg, Germany) and University of Tennessee Research Foundation (Knoxville, Tenn.).

"Chip on ceramics power module with low inductance and compact arrangement" was invented by Rudiger Kusch (Braunschweig, Germany), Yue Sun (Knoxville, Tenn.), Hua Bai (Knoxville, Tenn.) and Hendrik Gerth (Lehrte, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "Approaches, techniques, and mechanisms are disclosed for packaging electric power components. A power module comprises: a three-dimensional (3D) cooling structure that has a plurality of planar sides; a first set of mountable power components tha...