US Patent Issued to UNIWERSYTET JAGIELLONSKI, THE TRUSTEES OF INDIANA UNIVERSITY on July 1 for "Modular modelling kit for drawing geometric structures" (American, Polish Inventors)

ALEXANDRIA, Va., July 3 -- United States Patent no. 12,347,335, issued on July 1, was assigned to UNIWERSYTET JAGIELLONSKI (Cracow, Poland) and THE TRUSTEES OF INDIANA UNIVERSITY (Bloomington, Ind.).

"Modular modelling kit for drawing geometric structures" was invented by Pawel Bernard (Tomaszowice, Poland) and James Mendez (Franklin, Ind.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a modular modelling kit for drawing geometric structures using a handheld 3D printing pen, comprising construction modules (1), and is characterized in that each construction module (1) has a basically flat base (2) and at least one substantially vertical post (4) protruding from the base (2), having a c...