US Patent Issued to UNIVERSITY OF PITTSBURGH-OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION, UNIVERSIDAD DE SANTIAGO DE CHILE, UPMC on Sept. 23 for "Tuning adhesion at contacting device interfaces: geometric tools for minimizing surface fouling" (American, Chilean Inventors)

Posted On: 2025-09-23

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,419,998, issued on Sept. 23, was assigned to UNIVERSITY OF PITTSBURGH-OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION (Pittsburgh), UNIVERSIDAD DE SANTIAGO DE CHILE (Santiago, Chile) and UPMC (Pittsburgh).

"Tuning adhesion at contacting device interfaces: geometric tools for minimizing surface fouling" was invented by William R. Wagner (Gibsonia, Pa.), Sachin Shankar Velankar (Pittsburgh), Sang Ho Ye (Pittsburgh), Edith Tzeng (Presto, Pa.), Luka Pocivavsek (Pittsburgh) and Enrique Cerda (Santiago, Chile).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to substrates and composites having dynamic, reversible micron-level lumina...

Click here to read full article from source

To read the full article or to get the complete feed from this publication, please Contact Us.

Exclusive

Category

Source

Publication

Location

US Patent Issued to UNIVERSITY OF PITTSBURGH-OF THE COMMONWEALTH SYSTEM OF HIGHER EDUCATION, UNIVERSIDAD DE SANTIAGO DE CHILE, UPMC on Sept. 23 for "Tuning adhesion at contacting device interfaces: geometric tools for minimizing surface fouling" (American, Chilean Inventors)