US Patent Issued to UNIVERSITY OF MARYLAND, COLLEGE PARK on Feb. 10 for "Multi-stage vapor-venting manifold-microchannel heat sink, and systems and methods for use thereof" (District Of Columbia, Maryland Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,296, issued on Feb. 10, was assigned to UNIVERSITY OF MARYLAND, COLLEGE PARK (College Park, Md.).

"Multi-stage vapor-venting manifold-microchannel heat sink, and systems and methods for use thereof" was invented by Raphael Kahat Mandel (Washington) and Michael M. Ohadi (Clarksville, Md.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A manifold-microchannel (MMC) heat sink can comprise a plurality of microchannels and a manifold. The microchannels can be segregated into successive heat transfer stages. The manifold can include at least one connecting channel and at least one vapor permeable membrane portion. Each connecting channel can fluidically co...