US Patent Issued to University of Electronic Science and Technology of China, Institute of Electronic and Information Engineering of UESTC in Guangdong on Nov. 4 for "Termination structure of super-junction power device comprising plurality of runway-shaped rings as the resistive field plate" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 6 -- United States Patent no. 12,464,766, issued on Nov. 4, was assigned to University of Electronic Science and Technology of China (Chengdu, China) and Institute of Electronic and Information Engineering of UESTC in Guangdong (Dongguan, China).

"Termination structure of super-junction power device comprising plurality of runway-shaped rings as the resistive field plate" was invented by Ming Qiao (Chengdu, China), Ruidi Wang (Chengdu, China), Yibing Wang (Chengdu, China) and Bo Zhang (Chengdu, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A termination structure of a super-junction power device has a novel polysilicon resistive field plate at the top of a termination region betw...