US Patent Issued to United Semiconductor (Xiamen) on Sept. 30 for "Cleaning process of wafer polishing pad and cleaning nozzle" (Singaporean, Chinese Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,548, issued on Sept. 30, was assigned to United Semiconductor (Xiamen) Co. Ltd. (Fujian, China).

"Cleaning process of wafer polishing pad and cleaning nozzle" was invented by Shih-Jie Lin (Fujian, China), Ching-Wen Teng (Singapore), Kuo Liang Huang (Singapore) and Wen Yi Tan (Fujian, China).

According to the abstract* released by the U.S. Patent & Trademark Office: "A cleaning process of wafer polishing pad, the process includes providing a wafer polishing pad, performing a planarization process with the wafer polishing pad, leaving a residue on the wafer polishing pad after the planarization process, and performing a cleaning step with a cleaning nozzle to remove the residue, t...