US Patent Issued to TOWA on Feb. 18 for "Resin molded product production method, molding die, and resin molding apparatus" (Japanese Inventor)

ALEXANDRIA, Va., Feb. 19 -- United States Patent no. 12,230,512, issued on Feb. 18, was assigned to TOWA Corp. (Kyoto, Japan).

"Resin molded product production method, molding die, and resin molding apparatus" was invented by Ryota Nakatsukasa (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a resin molded product production method that can reduce the molding defects even when resin-molding is performed in a state where a chip is temporarily bonded to a carrier via a temporary bonding sheet. The method for producing a resin molded product obtained by subjecting an object to be molded being a chip 21 temporarily bonded to a carrier 11 via a temporary bonding sheet 12...