US Patent Issued to TOWA on Dec. 30 for "Transfer apparatus, resin molding apparatus, and method for manufacturing resin molded product" (Japanese Inventor)

ALEXANDRIA, Va., Dec. 31 -- United States Patent no. 12,508,754, issued on Dec. 30, was assigned to TOWA Corp. (Japan).

"Transfer apparatus, resin molding apparatus, and method for manufacturing resin molded product" was invented by Syuhei Yoshida (Uji, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention enables a reference surface member to reliably contact a side surface of a recess of a molding die, and is directed to a conveyance apparatus that conveys an object to be molded to a molding die in which a recess is formed on a side of a mold surface on which the object to be molded is placed, the conveyance apparatus including: a position reference mechanism having a reference surface...