ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,539,657, issued on Feb. 3, was assigned to TOPPAN HOLDINGS INC. (Tokyo).
"Resin film, laminate, and packaging body" was invented by Kaoru Furuta (Tokyo), Osamu Tokinoya (Tokyo) and Mikinori Yamada (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A resin film is laminated thereon a gas barrier layer having gas barrier properties to constitute a laminate for a packaging body. The resin film contains polyethylene terephthalate. In a cross section of the resin film, the softening temperature of the resin film in the width direction and the softening temperature thereof in the flow direction measured by local thermal analysis are in the range of 200deg C...