ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,832, issued on Jan. 27, was assigned to TONG HSING ELECTRONIC INDUSTRIES LTD. (Taipei, Taiwan).
"Power chip packaging structure" was invented by Chung-Hsiao Lien (Taipei, Taiwan), Wei-Ming Lu (Taipei, Taiwan), Jia-Yi Wu (Taipei, Taiwan) and Zzu-Chi Chiu (Taipei, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A power chip packaging structure includes: a ceramic substrate; a first and a second top metal layers are formed on the ceramic substrate; a bottom metal layer formed on the ceramic substrate; a power chip having an active surface and a chip back surface. The active surface has a contact pad, and the chip back surface is connected to the ...