ALEXANDRIA, Va., June 25 -- United States Patent no. 12,341,004, issued on June 24, was assigned to Tokyo Electron Ltd. (Tokyo).

"Film formation method and film formation apparatus" was invented by Yumiko Kawano (Nirasaki, Japan), Shuji Azumo (Nirasaki, Japan) and Shinichi Ike (Hwaseong-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A film formation method includes (A) to (C) below. (A) Providing a substrate including, on a surface of the substrate, a first region in which a first material is exposed and a second region in which a second material different from the first material is exposed. (B) Supplying, to the surface of the substrate, vapor of a solution that contains a raw material of a ...