ALEXANDRIA, Va., March 26 -- United States Patent no. 12,259,365, issued on March 25, was assigned to The University of Southern Mississippi (Hattiesburg, Miss.).

"Methodology and instrumentation for thin film mechanical analysis" was invented by Xiaodan Gu (Hattiesburg, Miss.), Dakota F. Ehlenberg (Baton Rouge, La.) and Song Zhang (Hattiesburg, Miss.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides for a material characterization system, method, and instrumentation for measuring the mechanical properties of nano-scale thin films. The thin film mechanical characterization system, method, and instrumentation of the present invention for ultra-thin films includes a motor and load cell. The...