US Patent Issued to The Government of the United States, as represented by the Secretary of the Army on July 15 for "Terahertz plasmonics for testing very large-scale integrated circuits under bias" (Maryland, New York Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,360,159, issued on July 15, was assigned to The Government of the United States, as represented by the Secretary of the Army (Washington).

"Terahertz plasmonics for testing very large-scale integrated circuits under bias" was invented by Greg Rupper (Silver Spring, Md.), John Suarez (Brooklyn, N.Y.), Sergey Rudin (Dayton, Md.), Meredith Reed (Perry Hall, Md.) and Michael Shur (Latham, N.Y.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Various embodiments are described that relate to failure determination for an integrated circuit. An integrated circuit can be tested to determine if the integrated circuit is functioning properly. The integrated circuit ...