US Patent Issued to TANAZAWA HAKKOSHA, ESCHMANN TEXTURES INTERNATIONAL on Oct. 14 for "Resin molding die, method for manufacturing resin molding die, method for manufacturing resin molded article, and system for manufacturing resin molded article" (German, Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,030, issued on Oct. 14, was assigned to TANAZAWA HAKKOSHA Co. LTD. (Higashiosaka, Japan) and ESCHMANN TEXTURES INTERNATIONAL GMBH (Gummersbach, Germany).

"Resin molding die, method for manufacturing resin molding die, method for manufacturing resin molded article, and system for manufacturing resin molded article" was invented by Mitsushi Sogabe (Higashiosaka, Japan), Melanie Eurich (Heilbronn, Germany) and Frederik Eurich (Bad Friedrichshal, Germany).

According to the abstract* released by the U.S. Patent & Trademark Office: "To provide a resin molded product having a desired surface shape, a resin molding mold which can manufacture the resin molded product and a method of manuf...