US Patent Issued to TAMURA on March 25 for "Photosensitive dry film, and printed wiring board with photosensitive dry film" (Japanese Inventors)

ALEXANDRIA, Va., March 26 -- United States Patent no. 12,259,652, issued on March 25, was assigned to TAMURA Corp. (Tokyo).

"Photosensitive dry film, and printed wiring board with photosensitive dry film" was invented by Ryoya Takashima (Iruma, Japan), Masanobu Ishizaka (Iruma, Japan) and Shinji Imai (Iruma, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a photosensitive dry film enabling a photocured film being excellent in insulation reliability and resolution and having a frosted appearance to be obtained. A photosensitive dry film including a support film having a first main surface and a second main surface opposite to the first main surface, and a photosensitive re...