ALEXANDRIA, Va., Sept. 17 -- United States Patent no. D1,093,313, issued on Sept. 16, was assigned to TAMURA Corp. (Tokyo) and TAMURA CORPORATION OF CHINA LIMITED (Shanghai).
"Coil for substrate mounting" was invented by Hideto Saeki (Shanghai), Junji Kondo (Shanghai), Jinwei Lin (Shanghai), Xiaoming Yang (Shanghai) and Jian Wang (Shanghai).
The patent was filed on Sept. 15, 2022, under Application No. D/853,493.
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