US Patent Issued to TAIYO HOLDINGS on Oct. 21 for "Curable resin multilayer body, dry film, cured product and electronic component" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,447,725, issued on Oct. 21, was assigned to TAIYO HOLDINGS Co. LTD. (Hiki-gun, Japan).

"Curable resin multilayer body, dry film, cured product and electronic component" was invented by Shoko Mishima (Hiki-gun, Japan), Shoya Sekiguchi (Hiki-gun, Japan), Kota Oki (Hiki-gun, Japan) and Nobuhiro Ishikawa (Hiki-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a curable resin laminate capable of easily producing an insulating layer having low dielectric properties and excellent adhesion (peel strength) to a conductor layer. A curable resin laminate includes: a first resin layer including a first curable composition, and a second resin lay...