US Patent Issued to TAIYO HOLDINGS on May 6 for "Curable resin composition, dry film and cured product thereof, and electronic component including cured product" (Japanese Inventors)

ALEXANDRIA, Va., June 10 -- United States Patent no. 12,291,604, issued on May 6, was assigned to TAIYO HOLDINGS Co. LTD. (Hiki-gun, Japan).

"Curable resin composition, dry film and cured product thereof, and electronic component including cured product" was invented by Chihiro Funakoshi (Hiki-gun, Japan) and Yoko Shibasaki (Hiki-gun, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a curable resin composition having developability and resolution improved without degrading the heat resistance and the chemical resistance, furthermore, a curable resin composition that is useful as a PID material for optical uses or a material for optical sensor protective films and enables the formation of a cu...