US Patent Issued to Taiwan Semiconductor Manufacturing on June 17 for "Physical vapor deposition (PVD) with target erosion profile monitoring" (Taiwanese Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,334,319, issued on June 17, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Physical vapor deposition (PVD) with target erosion profile monitoring" was invented by Chia-Hsi Wang (Changhua County, Taiwan) and Yen-Yu Chen (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A physical vapor deposition (PVD) system includes: a chamber body; a substrate support disposed within the chamber body and capable of supporting a substrate; a PVD target; and a target profile monitoring subsystem. The PVD target includes: a target plate comprising a target material; and a backing plate attached to the target plate and compr...