US Patent Issued to Taiwan Semiconductor Manufacturing on June 10 for "Chemical mechanical polish slurry and method of manufacture" (Taiwanese Inventors)

ALEXANDRIA, Va., June 18 -- United States Patent no. 12,327,734, issued on June 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Chemical mechanical polish slurry and method of manufacture" was invented by Chun-Hao Kung (Hsinchu, Taiwan), Tung-Kai Chen (New Taipei, Taiwan), Chih-Chieh Chang (Hsinchu, Taiwan), Kao-Feng Liao (Hsinchu, Taiwan), Hui-Chi Huang (Zhubei, Taiwan) and Kei-Wei Chen (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of manufacturing a chemical-mechanical polishing (CMP) slurry and methods of performing CMP process on a substrate comprising metal features are described herein. The CMP slurry may be manufactured using a balanced conc...