US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 3 for "Integrated circuit package and method" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 3 -- United States Patent no. 12,543,564, issued on Feb. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Integrated circuit package and method" was invented by Sey-Ping Sun (Hsinchu, Taiwan) and Shih Wei Liang (Taichung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A device package includes a first die comprising a semiconductor substrate; an isolation layer on the semiconductor substrate, wherein the isolation layer is a first dielectric material; a first dummy via penetrating through the isolation layer and into the semiconductor substrate; a bonding layer on the isolation layer, wherein the bonding layer is a second dielectric material that...