US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 10 for "Methods of forming an abrasive slurry and methods for chemical-mechanical polishing" (Taiwanese, American Inventors)

ALEXANDRIA, Va., Feb. 11 -- United States Patent no. 12,550,695, issued on Feb. 10, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Methods of forming an abrasive slurry and methods for chemical-mechanical polishing" was invented by Chia Hsuan Lee (Tainan, Taiwan), Chun-Wei Hsu (Hsinchu, Taiwan), Chia-Wei Ho (Kaohsiung, Taiwan), Chi-Hsiang Shen (Tainan, Taiwan), Li-Chieh Wu (Hsinchu, Taiwan), Jian-Ci Lin (Hsinchu, Taiwan), Chi-Jen Liu (Taipei, Taiwan), Yi-Sheng Lin (Taichung, Taiwan), Yang-Chun Cheng (Portland, Ore.), Liang-Guang Chen (Hsinchu, Taiwan), Kuo-Hsiu Wei (Tainan, Taiwan) and Kei-Wei Chen (Tainan, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Methods of form...