US Patent Issued to Taiwan Semiconductor Manufacturing on Dec. 16 for "Methods of forming semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Dec. 16 -- United States Patent no. 12,501,697, issued on Dec. 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Methods of forming semiconductor devices" was invented by Wan-Yi Kao (Baoshan Township, Taiwan), Szu-Ping Lee (Changhua County, Taiwan), Che-Hao Chang (Hsinchu, Taiwan), Chun-Heng Chen (Hsinchu, Taiwan), Yung-Cheng Lu (Hsinchu, Taiwan) and Chi On Chui (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "In an embodiment, a method includes: forming a first fin and a second fin extending from a semiconductor substrate; depositing a liner layer along a first sidewall of the first fin, a second sidewall of the second fin, and a top surface ...