US Patent Issued to Sung Ho Lee on Sept. 30 for "How to layout the signal lines on the upper layer of the conductor" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,429,979, issued on Sept. 30, was assigned to Sung Ho Lee (Seogwipo-si, South Korea).

"How to layout the signal lines on the upper layer of the conductor" was invented by Sung Ho Lee (Seogwipo-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention relates to the CDA that constitutes the capacitive detection device of the present invention placed on the upper side of the conductor. It aims to narrow the width of the far-distance CDA signal line, which was previously widened to reduce resistance, to be the same as the width of the near-distance signal line. As a result, this reduces the time constant in the far-distance CDA, ...