US Patent Issued to Sun Chemical on July 15 for "Low bond-temperature hot melt adhesive with high impact strength and chemical resistance" (New Jersey Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,359,097, issued on July 15, was assigned to Sun Chemical Corp. (Parsippany, N.J.).

"Low bond-temperature hot melt adhesive with high impact strength and chemical resistance" was invented by Paul Kurtz (Bloomfield, N.J.), Bo Sun (Carlstadt, N.J.), Philippe Schottland (Carlstadt, N.J.), Ewelina Szymczak (Carlstadt, N.J.), Jerome Moyer (Carlstadt, N.J.) and Saeid Savarmand (Carlstadt, N.J.).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a hot melt adhesive, comprising polyester resins with a Tg below 0deg C. and frequently combined with polyester resins with a Tg above 50deg C. that can be applied at 80deg C. or lower, having ...