US Patent Issued to SUMCO on April 29 for "Polishing head, polishing apparatus, and method of manufacturing semiconductor wafer" (Japanese Inventors)

ALEXANDRIA, Va., June 9 -- United States Patent no. 12,285,840, issued on April 29, was assigned to SUMCO Corp. (Tokyo).

"Polishing head, polishing apparatus, and method of manufacturing semiconductor wafer" was invented by Yuki Nakano (Saga, Japan), Ryoya Terakawa (Saga, Japan), Takayuki Kihara (Saga, Japan) and Hiroki Ota (Saga, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A polishing head includes a first ring-shaped member having an opening; a plate-shaped member that closes the opening on an upper side of the first ring-shaped member; a membrane that closes the opening on a lower side of the first ring-shaped member; a back pad adhered to a lower surface of the membrane; and a second ring-shaped...