US Patent Issued to STMICROELECTRONICS on June 3 for "Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit" (Singaporean Inventors)

ALEXANDRIA, Va., June 4 -- United States Patent no. 12,322,692, issued on June 3, was assigned to STMICROELECTRONICS PTE LTD (Singapore).

"Solder mask for thermal pad of a printed circuit board to provide reliable solder contact to an integrated circuit" was invented by Daniel Yap (Singapore) and Hung Meng Loh (Bukit Panjang, Singapore).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a solder connection includes forming a solder mask on a thermal pad of a printed circuit board. The solder mask leaves unmasked portions of the thermal pad and forming the solder mask includes forming a plurality of mask stripes extending from edges of each unmasked portion towards a center of the unmasked port...