US Patent Issued to STMicroelectronics (Grenoble 2) on March 11 for "Package for an integrated circuit and manufacturing method" (French Inventor)

ALEXANDRIA, Va., March 12 -- United States Patent no. 12,249,549, issued on March 11, was assigned to STMicroelectronics (Grenoble 2) SAS (Grenoble, France).

"Package for an integrated circuit and manufacturing method" was invented by Jerome Lopez (Saint Jean de Moirans, France).

According to the abstract* released by the U.S. Patent & Trademark Office: "An encapsulation hood is fastened onto electrically conductive zones of a support substrate using springs. Each spring has a region in contact with an electrically conductive path contained in the encapsulation hood and another region in contact with a corresponding one of the electrically conductive zones. The fastening of the part of the encapsulation hood onto the support substrate com...