US Patent Issued to SK hynix, IUCF-HYU (Industry-University Cooperation Foundation Hanyang University) on Sept. 30 for "Chemical mechanical polishing slurry composition for polishing boron silicon compound, chemical mechanical polishing method and method of fabricating semiconductor device using the same" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,428,581, issued on Sept. 30, was assigned to SK hynix Inc. (Icheon, South Korea) and IUCF-HYU (Industry-University Cooperation Foundation Hanyang University) (Seoul, South Korea).

"Chemical mechanical polishing slurry composition for polishing boron silicon compound, chemical mechanical polishing method and method of fabricating semiconductor device using the same" was invented by Cheolmin Shin (Seoul, South Korea), Hyun Goo Kang (Seoul, South Korea), Jong Young Cho (Hanam, South Korea), Ungyu Paik (Seoul, South Korea), Taeseup Song (Seoul, South Korea) and Dong Hyeok Kim (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A CMP slurry c...