ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,457,791, issued on Oct. 28, was assigned to SK hynix Inc. (Icheon, South Korea), Chungbuk National University Industry-Academic Cooperation Foundation (Cheongju, South Korea), Korea University Research and Business Foundation, Sejong Campus (Sejong, South Korea) and Korea Institute of Energy Research (Daejeon, South Korea).
"Method of forming contact structure, method of fabricating semiconductor device, contact structure and semiconductor device including the same" was invented by Ka-Hyun Kim (Cheongju, South Korea), Hyun Seok Lee (Daejeon, South Korea), Jae Woo Lee (Sejong, South Korea) and Joon-Ho Oh (Busan, South Korea).
According to the abstract* released by the U.S. Patent & Tr...