ALEXANDRIA, Va., June 25 -- United States Patent no. 12,342,457, issued on June 24, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan).
"Wiring board and manufacturing method of wiring board" was invented by Takashi Kasuga (Nagano, Japan), Tomoyuki Shimodaira (Nagano, Japan), Hikaru Tanaka (Nagano, Japan), Naotaka Noguchi (Nagano, Japan), Takashi Sato (Nagano, Japan) and Hitoshi Kondo (Nagano, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A wiring board includes: a wiring layer; an insulating layer laminated on the wiring layer; an opening portion penetrating through the insulating layer to the wiring layer; a recess portion formed in a surface of the wiring layer exposed from the ope...