ALEXANDRIA, Va., Jan. 23 -- United States Patent no. 12,191,276, issued on Jan. 7, was assigned to SHINKAWA LTD. (Tokyo).
"Mounting apparatus" was invented by Alexander Dzhangirov (Tokyo) and Kohei Seyama (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "The present invention provides a mounting apparatus, including a bonding stage holding a substrate on which a semiconductor chip is arranged; a base stand; a mounting head mounted with a pressing tool that presses the semiconductor chip on the substrate; and a film arranging mechanism provided on the base stand moving a cover film along the bonding stage to arrange the cover film between the semiconductor chip pressed by the substrate and the pressing to...