ALEXANDRIA, Va., Aug. 26 -- United States Patent no. 12,400,993, issued on Aug. 26, was assigned to SHINKAWA LTD. (Tokyo).
"Substrate holder and bonding system" was invented by Kohei Seyama (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "A bonding system (90) is provided with a bonding device (80) for bonding semiconductor chips (45) to individual substrates (41), and a substrate holder (10) for holding the individual substrates (41), the bonding device (80) being provided with a stage (31) for fixing, by suction, the substrate holder (10) on a placement surface (13a), the substrate holder (10) being provided with a plate-shaped base (11) and a positioning member (21) that is provided on the base (11) ...