US Patent Issued to SHIN-ETSU CHEMICAL on Oct. 14 for "Low dielectric silica powder, resin composition containing the silica powder, and method for manufacturing low dielectric silica powder" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,441,892, issued on Oct. 14, was assigned to SHIN-ETSU CHEMICAL Co. LTD. (Tokyo).

"Low dielectric silica powder, resin composition containing the silica powder, and method for manufacturing low dielectric silica powder" was invented by Toshio Shiobara (Annaka, Japan) and Hajime Itokawa (Annaka, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for manufacturing a low dielectric silica powder incudes heat-treating a silica powder at a temperature of 500deg C. to 1500deg C. to achieve 0.0005 or less of a dielectric loss tangent of the silica powder at 10 GHz, and etching a surface of the heat-treated silica powder with an etching solution. A si...