ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,447,564, issued on Oct. 21, was assigned to Senju Metal Industry Co. Ltd. (Tokyo).
"Solder alloy, solder ball, and solder joint" was invented by Yuuki Iijima (Tokyo), Hiroshi Okada (Tokyo), Shunsaku Yoshikawa (Tokyo), Takashi Saito (Tokyo), Kanta Dei (Tokyo) and Takahiro Matsufuji (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a solder alloy, a solder ball, and a solder joint which have an excellent pin contact performance and a high bonding strength. The solder alloy has an alloy composition consisting of, by mass %, Ag: 0.8 to 1.5%, Cu: 0.1 to 1.0%, Ni: 0.01 to 0.10%, and P: 0.006% to 0.009%, with the balance being Sn. The alloy co...