US Patent Issued to Senju Metal Industry on Oct. 21 for "Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint" (Japanese Inventors)

ALEXANDRIA, Va., Oct. 28 -- United States Patent no. 12,447,565, issued on Oct. 21, was assigned to Senju Metal Industry Co. Ltd. (Tokyo).

"Lead-free and antimony-free solder alloy, solder ball, ball grid array, and solder joint" was invented by Takashi Saito (Tokyo), Hiroki Sudo (Tokyo) and Mai Susa (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided are a lead-free and antimony-free solder alloy which has a medium-low melting point and ensures solderability even after being held at a high temperature for a long time, a solder ball, a ball grid array, and a solder joint. The lead-free and antimony-free solder alloy has an alloy composition consisting of 12 to 23% by mass of In, and 0.001 to 0.08%...