US Patent Issued to SEKISUI CHEMICAL on Aug. 12 for "Heat-dissipating composition, heat-dissipating member, and filler aggregate for heat-dissipating member" (Japanese, American Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,384,950, issued on Aug. 12, was assigned to SEKISUI CHEMICAL Co. Ltd. (Osaka, Japan).

"Heat-dissipating composition, heat-dissipating member, and filler aggregate for heat-dissipating member" was invented by Masataka Sugimoto (Ebina, Japan), Abison Scaria (Takatsuki, Japan), Taku Sasaki (San Jose, Calif.), Hidehito Nishizawa (Ibaraki, Japan), Masafumi Yoshida (Sagamihara, Japan), Takaaki Mizuno (Saitama, Japan), Motoki Ozawa (Fujisawa, Japan), Tsukasa Ishigaki (Nishitokyo, Japan) and Hiroki Kudoh (Kawaguchi, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The heat-dissipating composition according to the present invention comprises a polymer matrix...