US Patent Issued to Rutgers, the State University of New Jersey on Sept. 30 for "Methods and devices for thickness-limited electrospray additive manufacturing" (South Korean, American Inventors)

ALEXANDRIA, Va., Sept. 30 -- United States Patent no. 12,427,717, issued on Sept. 30, was assigned to Rutgers, the State University of New Jersey (New Brunswick, N.J.).

"Methods and devices for thickness-limited electrospray additive manufacturing" was invented by Jonathan P. Singer (Cranford, N.J.) and Howon Lee (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method for simultaneous additive manufacturing and thickness-limited, electrospray deposition may include forming an electrically conductive target via additive manufacturing and exposing the electrically conductive target to an incident spray comprising a thermo-responsive polymer solution, in the presence of an electric field. Th...