US Patent Issued to Rohm and Haas Electronic Materials CMP Holdings on June 17 for "Offset pore poromeric polishing pad" (Japanese, American Inventors)

ALEXANDRIA, Va., June 19 -- United States Patent no. 12,330,261, issued on June 17, was assigned to Rohm and Haas Electronic Materials CMP Holdings Inc. (Newark, Del.).

"Offset pore poromeric polishing pad" was invented by Wei-Wen Tsai (Philadelphia), Katsumasa Kawabata (Kyoto, Japan), Hui Bin Huang (Monroeville, N.J.), Akane Uehara (Kyoto, Japan) and Yosuke Takei (Shimane, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The invention provides a porous polyurethane polishing pad that includes a porous matrix having large pores that extend upward from a base surface and open to an upper surface. The large pores extend to the top polishing surface and have lower and upper sections with a vertical orientat...